The FIDO Alliance and Qualcomm – Why FIDO for Snapdragon Sense ID?

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When: March 31, 2015 - 10:00 AM EDT - 11:00 AM EDT
Where: Webinar

Qualcomm is a member of the FIDO Alliance and recently launched its Qualcomm® Snapdragon Sense™ ID 3D fingerprint technology, the mobile industry’s first 3D fingerprint authentication solution based on ultrasonic technology. This new authentication platform utilizes Qualcomm® Secure MSM™ technology and the FIDO Alliance Universal Authentication Framework (UAF) specification to provide password-less authentication.

During this webinar, Asaf Ashkenazi, Director of Product Management at Qualcomm, will address the business and technology drivers for incorporating the FIDO specification into Snapdragon Sense ID and the implications of future-proofing.

Both the FIDO Alliance and Qualcomm will entertain a moderated Q&A session afterwards with all attendees.

Brett McDowell, Executive Director of the FIDO Alliance
Asaf Ashkenazi, Director of product management for Qualcomm Technologies, Inc

Download the “FIDO Sense ID” presentation
Download the “Qualcomm” presentation

View the webinar